| 摘要 |
PROBLEM TO BE SOLVED: To realize a soldering apparatus that consumes less power with easier maintenance and is not affected by stray current and induced current or the like without providing a pump drive means, such as a motor to the upper side of the solder and without the use of a solder tank of a capacity larger than that required. SOLUTION: A motor 6 is arranged at the bottom 2 (external wall side) of a solder tank 1, a pipe 5 is provided on a melted solder liquid surface 4 from the tank bottom 2 of the solder tank 1, a rotary shaft 7 of the motor 6 is provided through the pipe 5 and is then connected to a hollow shaft 8 covering the pipe on the solder liquid surface 4. The hollow shaft 8 extends toward the bottom 2 of the solder tank 1 to generate a jet wave 29 of the solder 10 by rotating the pump 12 formed around the solder tank 1. |
