发明名称 |
FORMATION OF SEMICONDUCTOR LAYER AND MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To realize a forming method of a semiconductor layer, wherein an epitaxial layer can be formed even at low temperatures and a treatment device can be readily maintained when a semiconductor layer is subjected to selective crystal growth, and a manufacturing method of a semiconductor device wherein the formation method is used. SOLUTION: A forming method of a semiconductor layer has a process for forming a mask 3 with an opening part 2 for exposing the surface of a base layer 1 on the base layer 1 and a process for forming a semiconductor layer by performing selective crystal growth for a semiconductor 4 by a catalytic CVD method on the surface of the exposed base layer 1 inside the opening part 2 of the mask 3. Manufacturing method of a semiconductor device uses this forming method of a semiconductor layer.
|
申请公布号 |
JP2000269140(A) |
申请公布日期 |
2000.09.29 |
申请号 |
JP19990069642 |
申请日期 |
1999.03.16 |
申请人 |
SONY CORP |
发明人 |
YAMOTO HISAYOSHI;YAMANAKA HIDEO;YAGI HAJIME;SATO YUICHI |
分类号 |
H01L29/78;C23C16/44;H01L21/20;H01L21/205;H01L21/28;H01L21/285;H01L21/336;H01L21/8238;H01L27/092;H01L29/786;(IPC1-7):H01L21/205;H01L21/823 |
主分类号 |
H01L29/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|