发明名称 FORMATION OF SEMICONDUCTOR LAYER AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize a forming method of a semiconductor layer, wherein an epitaxial layer can be formed even at low temperatures and a treatment device can be readily maintained when a semiconductor layer is subjected to selective crystal growth, and a manufacturing method of a semiconductor device wherein the formation method is used. SOLUTION: A forming method of a semiconductor layer has a process for forming a mask 3 with an opening part 2 for exposing the surface of a base layer 1 on the base layer 1 and a process for forming a semiconductor layer by performing selective crystal growth for a semiconductor 4 by a catalytic CVD method on the surface of the exposed base layer 1 inside the opening part 2 of the mask 3. Manufacturing method of a semiconductor device uses this forming method of a semiconductor layer.
申请公布号 JP2000269140(A) 申请公布日期 2000.09.29
申请号 JP19990069642 申请日期 1999.03.16
申请人 SONY CORP 发明人 YAMOTO HISAYOSHI;YAMANAKA HIDEO;YAGI HAJIME;SATO YUICHI
分类号 H01L29/78;C23C16/44;H01L21/20;H01L21/205;H01L21/28;H01L21/285;H01L21/336;H01L21/8238;H01L27/092;H01L29/786;(IPC1-7):H01L21/205;H01L21/823 主分类号 H01L29/78
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