SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a method for fabricating thereof are provided to reduce fabrication cost by packaging semiconductor chips in wafer sate. CONSTITUTION: A process for forming interconnects(14) and conductive supporting members(16) is performed to electrically connect electrode pads(10a) with external terminals corresponding thereto on a wafer(10) which is provided with semiconductor devices. In the following process, grooves(18) are formed along boundary lines of the semiconductor devices in the surface of the wafer. It is preferable that the grooves(18) have a V-shaped configuration. Resin(19) is coated on the surface of the wafer so that end surfaces of the conductive supporting members(16) are exposed and the external terminals(20) are arranged on the end surfaces of the conductive supporting members(16). In the final process, the wafer is diced along the boundary lines of the semiconductor devices to obtain a packaged semiconductor device(32).