| 摘要 |
<p>PROBLEM TO BE SOLVED: To cause no fatigue destruction of a guide plate due to long service time and prevent the contamination inside a furnace due to damages as well as the contamination of semiconductor wafers. SOLUTION: This equipment is provided with a wafer loading table arranged within a reaction furnace, a reaction gas supply mechanism to supply a reaction gas to the wafer loading table, a guide plate 2 to lead the reaction gas supplied from the reaction gas supply mechanism to the wafer loading table and guide a reamining gas after reaction to an exhaust mechanism side from the wafer loading table, and a supporting plate 3 to support the guide plate 2. The guide plate 2 is divided into a plurality of members and communicated to each other, and developed and arranged in a way that their surfaces may surround the wafer loading table.</p> |
