Producing solder connection between electrical/electronic component and carrier substrate involves solder coating of pure tin with thickness of less than 10 microns applied to metal pad

摘要

The method involves applying a solder coating (5) to a metal pad (6) for mounting the component (3); placing the component with its metal contact surface (7) on the solder coating; and soldering the component to the pad without flux using an activation gas atmosphere. The solder coating consists of a pure tin coating applied to the metal pad with a thickness of less than 10 microns. Independent claim is also included for a component carrier produced using the method.