发明名称 |
Mounting semiconductor chip on substrate layer |
摘要 |
Packing material (3,4) is inserted between the semiconductor chip and the carrier layer, such that when the chip is in place, the packing material is shifted, at least partially by the use of pressure, from one edge section (13) of the semiconductor chip to another edge section of the semiconductor chip. The pressure may be applied as a vacuum. A channel for the flow of packing material may be formed between the chip and the carrier layer. |
申请公布号 |
DE19908474(A1) |
申请公布日期 |
2000.09.07 |
申请号 |
DE1999108474 |
申请日期 |
1999.02.26 |
申请人 |
SIEMENS AG |
发明人 |
MUFF, SIMON;POHL, JENS;WINDERL, JOHANN |
分类号 |
H01L21/56;(IPC1-7):H01L21/58 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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