发明名称 APPARATUS FOR FORMING BALLS FOR WIRE BONDING AND METHOD OF THE WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of bonding failures by preventing variations in discharge gap due to bends in wire tails to enable optimum balls to be formed at all times. SOLUTION: An apparatus for wire bonding comprises a torch electrode (discharge electrode) 5, between which and the end of a wire tail 10a of a wire 10 discharge is generated to form a ball at the end of the wire tail 10a, the torch electrode 5 being constructed into a ring with a generally circular hollow 5a. Also in the apparatus, a capillary 2 which has an opening 2a dispensing the wire 10 at the lower end and is movable vertically is arranged in close agreement between the center of the opening 2a and the central axis of a hollow 5a, and the ball is formed at the end of the wire tail 10a by discharging. Next, by having the capillary 2 move downward until the capillary 2 passes through the hollow 5a of the torch electrode 5, to conduct bonding.
申请公布号 JP2000235996(A) 申请公布日期 2000.08.29
申请号 JP19990035365 申请日期 1999.02.15
申请人 SONY CORP 发明人 INOUE KANAME
分类号 H01L21/60;H05B7/06 主分类号 H01L21/60
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