| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-heating apparatus, capable of preventing the external atmosphere from being involved into a process chamber at a supply amount of an appropriate purge gas at carrying substrates in. SOLUTION: A flow F1 of a purge gas, to be supplied from a purge gas supply pipe 52b to a nozzle 10, abuts on a flow adjusting plate 14A (projection part) within a flow adjusting route 12 and is diffused to a flow in an X-direction and a flow in a Z-direction. The same operation of the purge gas as described is repeated with respect to the flow adjusting plates 14B, 14C positioned in a downstream in the flow adjusting route 12, and spacial uniformity in a flow speed thereof at a gas outflow port 9 of an exit of the nozzle 10 is increased. This purge gas flows into the processing chamber, and attains a flow with high uniformity at a carry-in port of a substrate W provided at a position confronting a gas inlet port 9, and flows outwardly of the substrate heating apparatus. As the result, at carrying of the substrate in, it is possible to prevent the external atmosphere from being involved into the process chamber at the supply amount of an appropriate purging gas.
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