| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of forming patterned solder bumps on a printed wiring board, which enables the patterned solder bumps adaptable to electrodes to be formed quickly, precisely, with minimum of deterioration, and uniformly on a plurality of electrodes arranged on the printed wiring board. SOLUTION: A method of forming patterned solder bumps on a printed wiring board 1 comprises a step of aligning a metal mask 3 with electrodes 2 on the printed wiring board 1 to be arranged, a step of applying creamy solder 4 to a metal pattern to form a cream solder layer on each electrode, a step of guiding and arranging the end of a tool 6 for jetting a flow of heated gas which can jet high-temperature nitrogen gas out of the end is positioned by a three-dimensional positioning device 10 in a noncontact manner over the cream solder layer, and a step of forming a solder bump on each electrode by sequentially repeating a process, wherein the high-temperature nitrogen gas is jetted out of the end of the tool 6 for jetting the flow of heated gas towards the surface of the creamy solder layer to melt the creamy solder layer, allowing hemispherical bumps to be formed.
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