发明名称 DEVICE AND METHOD FOR LOCATING AND RESECTING BONE
摘要 <p>A device (10) and a method for the location of a pedicle and resection of the corresponding lamina are disclosed. The device (10) includes an osteotome (12) having a cutting element (18) configured and dimensioned to remove a section of bone sized to accommodate a portion of an implant; and a pedicle finder (14) having a handle (20) at a proximal end (22) for manipulation of the pedicle finder (14), a pedicle locator (24) at a distal end (26) connected to the handle (20) by a shaft (28), and an osteotome guide (30) located on the shaft (28) configured and dimensioned to slidingly engage at least a portion of the osteotome (12).</p>
申请公布号 WO2000042924(A1) 申请公布日期 2000.07.27
申请号 CH1999000555 申请日期 1999.11.22
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