摘要 |
PURPOSE: An improved chip module adapted for a simple manufacture of a chip card of non-contact type is provided. CONSTITUTION: A chip module, especially for insertion in a body of a chip card, includes a carrier(10) and a chip(13) attached thereon by an adhesive(12). A first and a second strip conductors(16,17) are formed apart from both sides of the chip(13) on the carrier(10) and then connected to corresponding terminals on the chip(13) by bonding wires(18). The chip(13) may be coupled to an antenna provided in the chip card body via the strip conductors(16,17). On a reverse surface of the carrier(10), a plurality of contact pads(19) are provided and then connected to corresponding terminals on the chip(13) through bonding holes(21) in the carrier(10) by bonding wires(20). The chip module is characterized by a base-type elevation(23), such as a frame carrier, and a supplementary frame(22) on the elevation(23), both of which encompass the chip(13) either entirely or partially. The elevation(23) is fabricated together with the strip conductors(16,17) in the same material and the substantially same height. Besides, a covering material(24) is filled in the supplementary frame(22). |