发明名称 |
POLISHING METHOD AND POLISHING DEVICE |
摘要 |
<p>A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2). <IMAGE></p> |
申请公布号 |
EP1020254(A1) |
申请公布日期 |
2000.07.19 |
申请号 |
EP19990933146 |
申请日期 |
1999.07.29 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD |
发明人 |
OKAMURA, KOUICHI;SUZUKI, FUMIO;MASUMURA, HISASHI |
分类号 |
B24B37/12;B24B37/16;B24B41/047;B24D9/08;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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