发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 <p>A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2). <IMAGE></p>
申请公布号 EP1020254(A1) 申请公布日期 2000.07.19
申请号 EP19990933146 申请日期 1999.07.29
申请人 SHIN-ETSU HANDOTAI CO., LTD 发明人 OKAMURA, KOUICHI;SUZUKI, FUMIO;MASUMURA, HISASHI
分类号 B24B37/12;B24B37/16;B24B41/047;B24D9/08;H01L21/304;(IPC1-7):B24B37/04 主分类号 B24B37/12
代理机构 代理人
主权项
地址