| 摘要 |
PROBLEM TO BE SOLVED: To resolve surface mounting trouble caused by a shape of a print mark formed by a screen print method in a surface of a printed wiring board. SOLUTION: In the manufacturing method of a printed wiring board, after an outer layer circuit conductor 3 of a both-sided and multilayer printed wiring board is formed, a solid print part 8 for a print mark 5 is formed before formation of solder resist, and a solder resist film 4 is formed thereon. As a result, a print mark, etc., are formed by a pattern of solder resist, a wiring board surface can be finished smoothly and part mounting reliability is improved since a surface part can be mounted stably.
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