发明名称 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n-1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin. <IMAGE> |
申请公布号 |
EP1011139(A1) |
申请公布日期 |
2000.06.21 |
申请号 |
EP19980905817 |
申请日期 |
1998.03.09 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TAKADA, MASARU;KIMATA, KENRO;MINOURA, HISASHI;TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;KONDO, MITSUHIRO |
分类号 |
H05K3/00;H01L23/12;H01L23/498;H01L23/50;H05K1/11;H05K3/28;H05K3/34;H05K3/38;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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