发明名称 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n-1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin. <IMAGE>
申请公布号 EP1011139(A1) 申请公布日期 2000.06.21
申请号 EP19980905817 申请日期 1998.03.09
申请人 IBIDEN CO., LTD. 发明人 TAKADA, MASARU;KIMATA, KENRO;MINOURA, HISASHI;TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;KONDO, MITSUHIRO
分类号 H05K3/00;H01L23/12;H01L23/498;H01L23/50;H05K1/11;H05K3/28;H05K3/34;H05K3/38;H05K3/46 主分类号 H05K3/00
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