发明名称 RESIN-SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To set the vertical moving distance of a lower metal mold to be small. SOLUTION: A plurality of ejection rods 72 are installed on a movable casing 71. A rod drive part is driven, the movable casing 71 is lifted by eccentric rods 79, and a sealed lead frame of a lower metal mold is pushed up with the ejection rods 72. A cylinder is arranged between a pair of clamping pawls of a loader mechanism and an unloader mechanism, and the thickness of these mechanisms is reduced.
申请公布号 JP2000164616(A) 申请公布日期 2000.06.16
申请号 JP19980339152 申请日期 1998.11.30
申请人 TECHNO CREATE:KK 发明人 SAKAMOTO HIDEO
分类号 H01L21/56;B29C45/14;B29C45/17;B29C45/20;B29C45/42;(IPC1-7):H01L21/56 主分类号 H01L21/56
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