| 摘要 |
PROBLEM TO BE SOLVED: To increase cooling of a power electronic component by installing flow means for a heat transfer fluid in a layer on the side opposite to a first or a second composite structure. SOLUTION: An insulating silica layer 16 and crystalline silicon 18 are formed on a layer 10 to form a first composite structure 19. The first composite structure 19 is constituted of a first wafer 2 having grooves 6 and a second wafer 4 having grooves 8. A plurality of passages 12 which are flow means for a heat transfer fluid are formed through co-operation of shapes between the grooves 6 and 8, A second heat transfer and electrical insulation composite structure 119 has layers 110 and 116. The layer 116 is covered by a planar array 118 of mutually insulated conductive members and has passages 112 like the first composite structure 19. By causing a heat transfer fluid to flow in the passages 12, 112, the power electronic component 28 can be cooled efficiently by the layers 10 and 110. |
