METHOD FOR FORMING BOARDLESS CONTACT

摘要

PURPOSE: A method for forming a boardless contact is provided to prevent degradation of operation speed due to an aerial capacitance. CONSTITUTION: A low dielectricity layer is formed on a lower insulation layer of a semiconductor substrate. Next, area at which a line/space pattern is formed on the low dielectricity layer is etched away. Next, a metal layer is formed on the result area. Next, the metal layer is etched until surface of the low dielectricity layer is exposed, so that the line/space pattern is formed. Next, an upper insulation layer is formed on the result area. Next, the upper insulation layer is etched so that the line/space pattern is exposed.