发明名称 |
AUTOMATING SYSTEM FOR CUTTING AND SORTING WORKPIECE AND CONTROL METHOD THEREFOR |
摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a cost and work time by simplifying a process of cutting and sorting a substrate. SOLUTION: This automating system for cutting and sorting workpiece includes cutting and sorting equipment 1000 for unloading a cut plate simultaneously when sorting the cut plate by a prescribed mode by forming the cut plate by cutting a substrate composed of a large number of cells and a control part 2000 for transmitting work data and work indication required for the cut plate to the cutting and sorting equipment 1000 as a response to a demand when the work data required for the cut plate is demanded from the cutting and sorting equipment 1000.</p> |
申请公布号 |
JP2000158388(A) |
申请公布日期 |
2000.06.13 |
申请号 |
JP19990330593 |
申请日期 |
1999.11.19 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
HEN SEIJUN;AN SHOHAN;KYO MINNEI |
分类号 |
B26D7/18;B07C5/00;B26D7/27;B28D5/00;G02F1/13;G02F1/1333;G02F1/136;G05B19/418;(IPC1-7):B26D7/18 |
主分类号 |
B26D7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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