发明名称 |
Printed circuit board with integrated circuit devices mounted on both sides thereof |
摘要 |
<p>Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages. <IMAGE></p> |
申请公布号 |
EP0997944(A3) |
申请公布日期 |
2000.05.10 |
申请号 |
EP19990111996 |
申请日期 |
1995.05.12 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
RUSSELL, ERNEST;WALLACE, JAMES S.;BAUDOUIN, DANIEL |
分类号 |
H01L23/32;H01L23/495;H01L25/10;H05K1/14;H05K1/18;H05K3/30;(IPC1-7):H01L25/10 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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