| 摘要 |
PURPOSE: A method for directly attaching a semiconductor chip to an organic substrate is provided to apply to various semiconductor chip-scale package design such as chip attached directly to a board, chip constructed with an interim metal layer, center line combination, circumference combination, wire combination and flip-flop soldering. CONSTITUTION: A semiconductor device comprises: an integrated circuit chip(10) having active surface(10a) and passive surface(10c), wherein the active surface comprises a protection polymer layer(20) pre activated and giving adhesiveness and at least one bonding pad; an electrically insulated substrate(11) having a first and second surface(11a,11b); a number of conductive routing strips being in one body with the substrate; a number of contact pads(13) arranged on the first surface(11a) of the substrate, wherein at least one contact pad(13) is connected to at least one routing strip; a second surface(11b) of the substrate directly attached to the pre activated polymer layer(20); and a bonding wire(14) electrically connecting at least one bonding pad(10b) to at least one contact pad(13). |
