发明名称 COOLING SYSTEM OF SEMICONDUCTOR DIFFUSION DEVICE
摘要 PURPOSE: A cooling system of a semiconductor diffusion device flows air in a cooling line circulating the inside of the device, thereby preventing a damage of the device. CONSTITUTION: A cooling system of a semiconductor diffusion device has a cooling line for cooling O-ring(5,16,27,36) in order to prevent that the O-ring mounted to an entrance part(4,15,26,35) is damaged by an overheating, thereby maintaining a relation between the entrance of the diffusion path(1,12,23,32) and the door for opening the entrance. The liquid flowing in the cooling line mounted to the entrance part is an air so as to prevent that the device is damaged by a corrosion of components making the cooling line. Thereby, a preservation of the device is enhanced, using a cooling line is to be safe.
申请公布号 KR20000018374(A) 申请公布日期 2000.04.06
申请号 KR19980035934 申请日期 1998.09.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JAE CHOON;LEE, HEE MYUNG
分类号 H01L21/22;(IPC1-7):H01L21/22 主分类号 H01L21/22
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