Socket apparatus for IC packages

摘要

An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).