| 摘要 |
PROBLEM TO BE SOLVED: To improve heat resistance, insulating properties and adhesiveness at a high temperature of a resin composition by blending an aromatic polyamide resin having a phenolic hydroxide group and a specific linear polyamide resin. SOLUTION: An aromatic polyamide resin having a phenolic hydroxide group which resin comprises 5-100 mol% of a repeating unit of formula I and 0-95 mol% of a repeating unit of formula II is obtained by reacting an aromatic diamine compound having at least one alkyl group on the ortho-position of the terminal amino aryl group and an aromatic dicarboxylic acid having a phenolic hydroxide group. 1-70 pts.wt. of the aromatic polyamide resin is blended with an alcohol-soluble linear polyamide resin whose amide groups are partially di-methylated in the amount such that the total be 100 pts.wt. In the formulas, Ar is a bivalent aromatic group, R and R' are each H or a 1-4C alkyl but both are not H simultaneously, R2 is a 1-3C alkylene which may be substituted by F, and (n) is 1 or 2.
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