| 摘要 |
PURPOSE: The apparatus can detect the defect of non-repetitive patterns using an image processing method. CONSTITUTION: The apparatus is characterized by detecting the defect by comparing unit image by the image processing method using two cameras(116a, 116b). The apparatus improves the detection speed by comparing images at the same position of two different chips. A first light emitted from a first light source(102a) such as a mercury lamp are reflected from a first beam splitter(104a) and from a first mirror(101a) continuously and is incident to the first position of a first chip on a wafer(100). At the same time, a second light emitted from a second light source(102b) is incident to the same position as the first position of a second chip on the wafer. The first light is reflected from the first mirror and passes the first beam splitter again and is incident to a first camera(116a) and a first image sensor(118a) by a third mirror(114a), and the second light passes a second beam splitter(104b) and is incident to a second camera(116b) and to a second image sensor(118b) by a forth mirror(114b). The first camera inspects the image on the first position of the first chip on the wafer and the second camera inspects the image on the first position of the second chip on the wafer.
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