| 发明名称 |
Thermally conductive grease composition and semiconductor device using the same |
| 摘要 |
<p>A grease composition having high thermal conductivity and excellent heat dissipation ability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 mu m; and a semiconductor device utilizing the aforesaid grease composition. <IMAGE></p> |
| 申请公布号 |
EP0982392(A1) |
申请公布日期 |
2000.03.01 |
| 申请号 |
EP19990304369 |
申请日期 |
1999.06.04 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TAKAHASHI, TAKAYUKI;YAMADA, KUNIHIRO;ISOBE, KENICHI |
| 分类号 |
C10M105/04;C10M105/54;C10M107/50;C10M113/00;C10M113/06;C10M113/08;C10M169/00;C10M169/02;C10N10/04;C10N10/06;C10N20/02;C10N20/06;C10N30/08;C10N40/06;C10N40/14;C10N50/10;H01L23/373;(IPC1-7):C10M169/00;C08K3/00 |
主分类号 |
C10M105/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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