SENSOR AND METHOD OF PRODUCING THE SAME

摘要

Pads 24 and 25 to be bonded to connection members are formed at positions where the pads face electrode extraction holes 4a to 4c. A bonding agent 12 low in wettability for the surfaces of electrodes 1 and 3 is used. The bonding agent 12 and high-wettability material form the surfaces of the pads 24 and 25. This can firmly bond the connection members to the electrodes 1 and 3, and can prevent the electrodes 1 and 3 from short-circuiting.