METHOD AND APPARATUS FOR TREATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment method which can prevent the generation of nonuniformity and defective treatment caused by the falling of treating liquid from the discharge opening of a treating liquid discharge nozzle without lowering throughput and an apparatus for the method. SOLUTION: A cleaning/suction unit 16 is installed in one waiting pot 6, and a suction unit 17 is installed in the other waiting pot 7. After the tip part of a developer discharge nozzle 11 being cleaned by the unit 16 in the waiting pot 6, while the nozzle 11 is being moved from a position on one side of the outside of a substrate 100 held in a standstill state in a substrate holding part 1 to a position on the other side of the outside of the substrate 100 passing on the substrate 100, a developer is supplied on the substrate 100. After the developer in the slit-shaped discharge opening 15 of the nozzle 11 being sucked/ removed by the suction unit 17 in the waiting pot 7, the nozzle 11 is returned from the waiting pot 7y to the waiting pot 6.