| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide precursor composition sufficiently with standing even the etching process on a substrate surface, and suitably usable as a protective film or insulating film for semiconductors by making the composition include a polyamide acid and a specific reaction product. SOLUTION: This composition is obtained by including (A) a polyamic acid, (B) a reaction product from a tetracarboxylic acid dianhydride and an aminoalkoxysilane, and, as necessary, (C) a compound having photoreactive ethylenically unsaturated bond and amino group, and (D) a photopolymerization initiator; wherein the component A is such a compound as to be prepared, for example, by dissolving a diamine in an aprotic polar solvent (e.g. N-methyl-2- pyrrolidone) followed by addition of a tetracarboxylic acid dianhydride to afford a viscous solution; the tetracarboxylic acid dianhydride is pref. a compound of the formula (R1 is a 2-22C tetravelent organic group), and the diamine is pref. a compound of the formula H2N-R2-NH2 (R2 is a 1-22C bivalent organic group).
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