发明名称 |
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF |
摘要 |
PURPOSE: A semiconductor device having a trench separation and its production method are provided to have the high insulating property, to be suited to the slimming, and to prevent the leakage current. CONSTITUTION: Because a polysilicon layer(3) is formed between a semiconductor substrate(1) and a CVD silicon oxide film(4), the semiconductor device is relieved the stress by being a stress relieving film to absorb a mechanical stress generated between the semiconductor substrate(1) and the CVD silicon oxide film(4) at a heat process by transforming the structure of a film by a polysilicon grain. Therefore the insulating property of a trench separation formed by the CVD silicon oxide film suited to the miniature of the device is improved.
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申请公布号 |
KR20000011202(A) |
申请公布日期 |
2000.02.25 |
申请号 |
KR19990008530 |
申请日期 |
1999.03.13 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
UENO SHUICHI;INOUE YASUO;SHIRAHATA MASAYOSHI |
分类号 |
H01L21/302;H01L21/76;H01L21/762;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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