发明名称 SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
摘要 PURPOSE: A semiconductor device having a trench separation and its production method are provided to have the high insulating property, to be suited to the slimming, and to prevent the leakage current. CONSTITUTION: Because a polysilicon layer(3) is formed between a semiconductor substrate(1) and a CVD silicon oxide film(4), the semiconductor device is relieved the stress by being a stress relieving film to absorb a mechanical stress generated between the semiconductor substrate(1) and the CVD silicon oxide film(4) at a heat process by transforming the structure of a film by a polysilicon grain. Therefore the insulating property of a trench separation formed by the CVD silicon oxide film suited to the miniature of the device is improved.
申请公布号 KR20000011202(A) 申请公布日期 2000.02.25
申请号 KR19990008530 申请日期 1999.03.13
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 UENO SHUICHI;INOUE YASUO;SHIRAHATA MASAYOSHI
分类号 H01L21/302;H01L21/76;H01L21/762;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/302 主分类号 H01L21/302
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