PRINTED CIRCUIT BOARD AND MANUFACTURE METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacture method thereof are provided to make possible the control of the thickness of the opening for packing the chip as well as to reduce the manufacture cost and to simplify the manufacture method. CONSTITUTION: A printed circuit board manufacture method comprises the steps of: hardening a certain zone of ink layer after examining the rays under a state of blocking the certain zone of ink layer by a mask and then removing the non-hardened zone using a developing solution; forming a first ink layer by coating ink onto the whole board; forming an opening on the first ink layer; forming an inner circuit by plating the first ink layer with gold and then etching; forming a second ink layer on the first ink layer and the opening; and forming an opening on the second ink layer at a same width as it of the opening of the first ink layer.