| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material for a transfer method for obtaining a semiconductor package having a wiring part substantially free from a pinhole by using the transfer method, and a method for producing the same. SOLUTION: In a composite material wherein a carrier material 1, a barrier material 2 and a wiring forming material 3 are laminated and bonded, the wiring forming material 3 does not generate a flaw such as a pinhole in a wiring part by using the composite material for a transfer method being a rolled foil. The composite material 6 for the transfer method is produced by a method for bonding a strip material wherein the carrier material 1 and the barrier material 2 are laminated and the wiring forming material 2 under pressure to form a composite strip or a method subjecting the bonding surfaces of the barrier material 2 and the wiring forming material 3 to ion etching to laminate and bond both materials by rolling.
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