发明名称 HEAT-SEALING HOT PLATE AND MATERIAL FOR PREVENTING THE HEAT-SEALING HOT PLATE FROM SEIZING
摘要 PROBLEM TO BE SOLVED: To ensure good heat-sealing operability, heat-sealing strength and a long service life of an anti-sticking film to simplify formation and reproduction of the anti-sticking film by adding a heat-conductive filler to at least one of hardly seizing resin film and an adhesive mass. SOLUTION: A hot plate 1 with a heater 12 attached to an end face of a heat-insulating or low-heat-conductive plate-like holder 11 comprises a hardly seizing tape 2 equipped with an adhesive mass layer 22 on a surface of a resin film 21 which is excellent in heat resistance or peelability, a fluoro resin film for example, wherein the tape 2 is stuck to cover a tip of the heater 12. At this time, a heat-conductive filler is added to either of or both of the resin film 21 of the film 2 and the adhesive mass 22. The heat-conductive filler to be used may include ceramic powder such as fluorine nitride or metallic powder such as silver having an average particle diameter of approximately 1 to 2μm.
申请公布号 JP2000006925(A) 申请公布日期 2000.01.11
申请号 JP19980189950 申请日期 1998.06.18
申请人 NITTO DENKO CORP 发明人 FURUTA YOSHIHISA;TAKAHASHI SHUICHI;WATANABE YOSHINOBU
分类号 B65B51/10;(IPC1-7):B65B51/10 主分类号 B65B51/10
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