发明名称 |
Process for manufacturing an electronic circuit card |
摘要 |
An electronic circuit card and a process of manufacturing the electronic circuit card. The process includes the steps of providing the electronic circuit card with external electrical circuits. A photoimageable dielectric layer is formed on the electronic circuit card. A metal foil layer is laminated on the photoimageable dielectric layer and the metal foil layer is patterned to form a wire and a component add land pattern. The photoimageable dielectric layer is patterned and the wire and the component add land pattern are electrically connected to the electronic circuit card.
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申请公布号 |
US6009619(A) |
申请公布日期 |
2000.01.04 |
申请号 |
US19970864632 |
申请日期 |
1997.05.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LAUFFER, JOHN M. |
分类号 |
H05K1/00;H05K1/11;H05K3/00;H05K3/22;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/02 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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