发明名称 Process for manufacturing an electronic circuit card
摘要 An electronic circuit card and a process of manufacturing the electronic circuit card. The process includes the steps of providing the electronic circuit card with external electrical circuits. A photoimageable dielectric layer is formed on the electronic circuit card. A metal foil layer is laminated on the photoimageable dielectric layer and the metal foil layer is patterned to form a wire and a component add land pattern. The photoimageable dielectric layer is patterned and the wire and the component add land pattern are electrically connected to the electronic circuit card.
申请公布号 US6009619(A) 申请公布日期 2000.01.04
申请号 US19970864632 申请日期 1997.05.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LAUFFER, JOHN M.
分类号 H05K1/00;H05K1/11;H05K3/00;H05K3/22;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/02 主分类号 H05K1/00
代理机构 代理人
主权项
地址