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发明名称
Semiconductor device
摘要
<p>반도체장치에서, 칩표면에 부착되는 테이프의 접착층이 반도체소자의 최상면의 개구부와 오버랩되지 않도록 배치된다. 일반적인 종류의 테이프에서는, 테이프는 반도체소자 표면의 커버개구부로부터 적어도 0.1㎜의 거리를 유지하고, 두개의 커버가 있는 경우에는, 테이프가 반도체소자의 최상면의 개구부로부터 적어도 0.1㎜의 거리를 유지한다. 개구부는 휴즈개구부 또는 본딩패드 및 휴즈개구부를 포함한다.</p>
申请公布号
KR19990088318(A)
申请公布日期
1999.12.27
申请号
KR19990017469
申请日期
1999.05.15
申请人
null, null
发明人
이치노세미치히코
分类号
H01L21/60;H01L23/495;H01L23/50
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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