| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board wherein dispersion in dimension and solder short are avoided. SOLUTION: Related to an electronic circuit board 1 used for an hybrid IC comprising a lead frame 2 and such structure as multi-chip module, a notch part 6 wherein an end surface part of the board 1 is cut off is provided, and, when the lead frame 2 and the board 1 are connected together, the lead frame 2 is inserted into the notch part 6 for fixing so that lateral dislocation in pitch of the lead frame 2 is corrected. |
