| 摘要 |
PURPOSE:To improve the reliability of a semiconductor device by reducing the adhering area of an electrode adhered to a conductor piece on an insulating member of a package. CONSTITUTION:A semiconductor element dies 9 formed on one main surface side is formed with electrodes 6, 7 confronted with the surface of a package at the main surface side on a package 13 having an insulating member on the surface formed with a main body of metal. The electrodes are bonded to be electrically connected to conductor pieces 15a, 17a respectively formed on the metal or the insulating members 14, 16 on the surface of the package. The adhering areas of the electrodes 15a, 17a bonded to the pieces can be reduced. |
