HEAT SINK MOUNTING SYSTEM FOR SEMICONDUCTOR DEVICES

摘要

A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (8) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (8) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).