| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounting equipment which can is capable of moving a chip gripper accurately and rapidly. SOLUTION: This is a semiconductor mounting equipment provided with a chip gripper 20, which can be moved back and forth by a lever mechanism for lifting up a chip 30 from a chip carrier 32 at a first position A and then put the chip on a substrate 38 at a second position B. This equipment is provided with a first rotating lever 10, driven between two end positions Ea and Eb and a second rotating lever 12 driven in the opposite direction at a specified gear ratio. The gear ratio and the lengths h1, h2 of the first and the second rotating levers 10, 12 are so set that the rotating levers 10, 12 form a straight line at the end positions Ea and Eb so as to allow the chip gripper 20 to reach either the position A or B. |
