发明名称 Heat exchanger for cooling semi-conductor components
摘要 Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section, The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.
申请公布号 US5950721(A) 申请公布日期 1999.09.14
申请号 US19970915187 申请日期 1997.08.20
申请人 ALUSUISSE TECHNOLOGY & MANAGEMENT LTD. 发明人 BOCK, UWE;GLUECK, JOACHIM
分类号 F28F3/02;F28F3/04;H01L23/367;H05K7/20;(IPC1-7):F28F7/00 主分类号 F28F3/02
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