发明名称 |
Heat exchanger for cooling semi-conductor components |
摘要 |
Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section, The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.
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申请公布号 |
US5950721(A) |
申请公布日期 |
1999.09.14 |
申请号 |
US19970915187 |
申请日期 |
1997.08.20 |
申请人 |
ALUSUISSE TECHNOLOGY & MANAGEMENT LTD. |
发明人 |
BOCK, UWE;GLUECK, JOACHIM |
分类号 |
F28F3/02;F28F3/04;H01L23/367;H05K7/20;(IPC1-7):F28F7/00 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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