发明名称 |
Wafer cleaning method and system |
摘要 |
A wafer cleaning apparatus provides two opposed brushes for brushing a vertically disposed wafer in a tank which can contain a process liquid. A pressure controller adaptively controls the pressure exerted by the brushes on the wafer to compensate for brush wear. Rim driving wheels engage the wafer periphery with a porous jacket coupled to a fluid delivery system, thereby simultaneously rotating and cleaning the periphery of the wafer. The apparatus includes a fluid delivery system for separately and independently delivering a plurality of constituents of a cleaning solution to the brushes, thereby ensuring that a freshly mixed cleaning solution reaches the wafer. The tank can be filled with a process liquid through which megasonic waves provided by a transducer can propagate and impinge upon the wafer thereby enhancing the cleaning of the wafer or the brushes. |
申请公布号 |
AU2328499(A) |
申请公布日期 |
1999.08.23 |
申请号 |
AU19990023284 |
申请日期 |
1999.01.20 |
申请人 |
SILIKINETIC TECHNOLOGY, INC. |
发明人 |
ALEJANDRO GARCIA;BRENT KRICK;ANTHONY NICHTAWITZ;DANIEL NORDEEN;JOSH OEN;KENNETH SMITH;VINCENT SURO;DANIEL WOLF |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|