| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor plastic package with excellent heat radiation and heat resistance after moisture absorption. SOLUTION: In the semiconductor plastic package of a ball grid array a metal core printed wiring board is used. The metal core is boartly exposed in conical shapes at part of the surface, and one part of this top end is brought into contact with heat conductive adhesive or a semiconductor chip mounting metal foil, and a semiconductor chip fixed on the core is connected with the surrounding circuit conductor by wire bonding. Then, a front and back circuit is connected with a through-hole conductor insulted through thermosetting resin, and one or more through-holes are directly connected with the metallic wire, and the semiconductor chip part is resin sealed.</p> |
