发明名称 |
CHIP-TYPE ELECTRONIC COMPONENT STORAGE MOUNT OF PRESS DIE |
摘要 |
PROBLEM TO BE SOLVED: To provide a highly operative chip-type electronic component storage mount of a press die having a recess for storing a chip-type electronic component with a failure prevented in inserting and taking out the component. SOLUTION: A paper base material for the chip-type electronic component storage mount for a press die made of multilayered paper has a ratio of 0.80-1.00 of the narrowest part T2 to the longest part T1 in the MD direction of a cavity after left for 24 hours under a temperature of 23°C and relative humidity of 50%. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006273372(A) |
申请公布日期 |
2006.10.12 |
申请号 |
JP20050094445 |
申请日期 |
2005.03.29 |
申请人 |
OJI PAPER CO LTD |
发明人 |
YAMAMOTO MANABU;OKUYA TAKEHITO;TEJIMA IKUO |
分类号 |
B65D73/02;B65D85/86;D21H23/14;D21H27/00 |
主分类号 |
B65D73/02 |
代理机构 |
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地址 |
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