发明名称 CHIP-TYPE ELECTRONIC COMPONENT STORAGE MOUNT OF PRESS DIE
摘要 PROBLEM TO BE SOLVED: To provide a highly operative chip-type electronic component storage mount of a press die having a recess for storing a chip-type electronic component with a failure prevented in inserting and taking out the component. SOLUTION: A paper base material for the chip-type electronic component storage mount for a press die made of multilayered paper has a ratio of 0.80-1.00 of the narrowest part T2 to the longest part T1 in the MD direction of a cavity after left for 24 hours under a temperature of 23°C and relative humidity of 50%. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006273372(A) 申请公布日期 2006.10.12
申请号 JP20050094445 申请日期 2005.03.29
申请人 OJI PAPER CO LTD 发明人 YAMAMOTO MANABU;OKUYA TAKEHITO;TEJIMA IKUO
分类号 B65D73/02;B65D85/86;D21H23/14;D21H27/00 主分类号 B65D73/02
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