发明名称 FORMATION OF SEMICONDUCTOR THERMAL DIFFUSION LAYER
摘要 <p>PROBLEM TO BE SOLVED: To provide a technique of buried layer formation using Sb as well as a manufacturing method of efficiently forming an Sb diffusion source while suppressing a defective Si oxide film on an Si substrate. SOLUTION: A sputtered thin film 9 made of glass containing a second conductivity type impurity is formed on a substrate surface 1 as a second conductivity type impurity diffusion source when a second conductivity type film is formed by thermal diffusion on the surface of a first conductivity type substrate by selectively removing a mask layer formed on the substrate surface 1. Then, a glass layer 10 containing the second conductivity type impurity is formed on the surface of the sputtered thin film 9 to be heated so as to diffuse the impurities in the semiconductor for the formation of a second conductivity type diffused layers 2.</p>
申请公布号 JPH11195612(A) 申请公布日期 1999.07.21
申请号 JP19970368416 申请日期 1997.12.26
申请人 NEW JAPAN RADIO CO LTD 发明人 KIMURA CHIKAO
分类号 H01L21/225;H01L21/22;(IPC1-7):H01L21/225 主分类号 H01L21/225
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