High-speed optical modulator module

摘要

A high-speed optical modulator module which includes: a lead frame having an outer lead frame and an inner lead frame, the outer lead frame for receiving a high-speed signal; a substrate, in which a metal base having a matching impedance device, and a submount having a laser diode thereon, are formed; a first multi-bonding wire for electrically connecting the inner lead frame of the lead frame to one end of the matching impedance device; a second multi-bonding wire for electrically connecting the other end of the matching impedance device to one end of the metal base; and a dual-bonding wire for electrically connecting the other end of the metal base to the laser diode. The matching impedance device includes a matching resistor and a compensation capacitor connected in parallel. The module is formed by packaging and sealing the components other than the outer lead frame.