发明名称 Apparatus for dispensing flowable material
摘要 An apparatus for dispensing solder paste for application through a stencil or a screen to a circuit board includes a housing having an elongated chamber along a longitudinal axis and a rotatable member within the chamber. The housing has an inlet connected to a supply of solder paste and an elongated opening at the bottom of the chamber for delivering solder paste from the chamber. The rotatable member creates a pressure gradient within the chamber and causes delivery of the solder paste through the opening at controlled pressure. The rotatable member is spaced from an inner surface of the housing defining the chamber. The axis of rotation of the rotatable member is movable in two directions and the speed of rotation is adjustable. The forces on the rotating member are monitored in order to monitor solder conditions.
申请公布号 US5925187(A) 申请公布日期 1999.07.20
申请号 US19960598288 申请日期 1996.02.08
申请人 SPEEDLINE TECHNOLOGIES, INC.;MASSACHUSETTS INSTITUTE OF TECHNOLOGY 发明人 FREEMAN, GARY T.;BRAUNSTEIN, DANIEL
分类号 H05K3/12;(IPC1-7):B05C5/00 主分类号 H05K3/12
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