| 摘要 |
PROBLEM TO BE SOLVED: To improve position precision of an outer terminal against the outer form of a package, by forming an aligning pattern becoming a reference in a dicing process and an outer connection electrode deciding the outer diameter and the position of the outer terminal with same members and the same processes. SOLUTION: A cut aligning mark 11 formed of solder resist exists outside a product. An outer connection electrode 4a whose outer form and the position are decided by solder resist exists on a copper pattern of a product-side. When the outer diameter of the copper pattern is larger than the opening diameter of the opening part of solder resist, the cut aligning mark 11 is formed of solder resist deciding the outer diameter and the position of the outer connection electrode 4a. Thus, the position precision of the electrode against the outer form of the product improves. Consequently, the semiconductor package superior in the loading ability of the semiconductor package to a mother board and productivity is provided. |
