发明名称 PHOTOSENSITIVE COMPOSITION AND MANUFACTURE OF RELIEF PATTERN USING IT
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive composition, high in resolution and good in process stability, and a manufacturing method for a relief pattern, exhibiting excellent heat resistance, resolution, and chemical resistance, and giving a good shape. SOLUTION: This photosensitive composition contains (A) a compound having addition-polymerizing radicals or a polymer having addition-polymerizing radicals, (B)γ-butyrolactone, (C) a pigment compound having absorption at 450 nm to 600 nm, and (D) a photopolymerization initiator, and, in this manufacturing method for a relief pattern, a coating film of this photosensitive composition is irradiated with active light from above a mask having a pattern drawn thereon and non-irradiated parts are removed by developing them.
申请公布号 JPH11174675(A) 申请公布日期 1999.07.02
申请号 JP19970345952 申请日期 1997.12.16
申请人 HITACHI CHEM CO LTD 发明人 MIYASAKA MASAHIRO;KO MASAHIKO;SEYA TAKAHIRO
分类号 G03F7/027;C08F2/50;C08F4/76;C08L101/00;C09D201/00;G03F7/00;G03F7/029;(IPC1-7):G03F7/029 主分类号 G03F7/027
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