| 摘要 |
A method and apparatus for creating an electrically conductive path between ground conductors on a printed circuit board (PCB) and downwardly facing walls of an electromagnetic interference (EMI) housing, uses surface mountable conductive spring-like strips. A plurality of surface mount device receiving areas are provided at predermined spaced positions along the ground conductors on the PCB, and a pick and place device is used for automatically positioning a plurality of the conductive spring-like strips at each of the surface mount device receiving areas, each strip having at least one upwardly facing engagement portion. Thereafter, the conductive spring-like strips are affixed on the PCB by, for example, wavesolder techniques. The engagement portion is adapted to engage and make electrically conductive contact with an abutting portion of an EMI housing during fastening of the EMI housing to the PCB.
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