发明名称 Semiconductor device including via hole and isolating circumferential member
摘要 A semiconductor device includes a semiconductor element, such as a field effect transistor, and an adjacent connection region including a via hole. A simple structure prevents leakage current from flowing from a p-type buffer layer to a source electrode of the field effect transistor through a backside electrode and a via hole upper electrode, avoiding degradation in the gate-source dielectric resistance. A groove having a depth extending from a surface of an n-type semiconductor layer through a n-type semiconductor layer and a p-type buffer layer isolates a field effect transistor from a via hole that extends from the surface of an n-type semiconductor layer to a second surface of a compound semiconductor substrate. The groove prevents leakage current from flowing in a backside electrode in the via hole.
申请公布号 US5917209(A) 申请公布日期 1999.06.29
申请号 US19960744456 申请日期 1996.11.07
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 ANDOH, NAOTO
分类号 H01L21/764;H01L21/285;H01L21/338;H01L21/765;H01L21/768;H01L21/8232;H01L23/48;H01L27/06;H01L29/06;H01L29/417;H01L29/812;(IPC1-7):H01L29/80;H01L29/00;H01L31/112 主分类号 H01L21/764
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