BUMP FORMATION METHOD, PRE-PROCESSING METHOD FOR SOLDER BONDING, SOLDER BONDING METHOD BUMP FORMATION DEVICE, PRE-PROCESSOR FOR SOLDER BONDING AND SOLDER BONDING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a bump formation method for forming a bump type electrode terminal in which a cleaning process can be made unnecessary, and reliability can be made excellent, by using an inexpensive and soft solder alloy without using any fusing agent in the solder bump formation of a part electrode accompanied with the miniaturization of an electronic part. SOLUTION: Process gas is supplied by a gas supplying means 31 to a plasma generating means 21 in a vacuum chamber 12, and plasma including hydrogen is generated with a low pressure by the plasma generating means 21. A soft solder alloy on the surface of a held object 11 to be processed is exposed in the plasma including hydrogen by an object to be processed exposing means 15, and irradiated with the plasma including hydrogen. The soft solder alloy is allowed to reflow in vacuum by a heating means 36 simultaneously or continuously with irradiation. Thus, a solder bump being a connecting terminal can be formed by the soft solder alloy on the surface of the object 11 to be processed.